SKC Co., a South Korean manufacturer of secondary battery parts and advanced materials, declared on Monday that it is taking a stake in a U.S. semiconductor packaging startup. The company is investing in Chipletz, an Austin-based fabless company, and will own approximately 12 percent of the firm through a Series B funding. SKC did not reveal the amount of the investment, citing the terms of the agreement.
Chipletz specializes in semiconductor substrate packaging for artificial intelligence and high-performance computing and was spun off from AMD, an American multinational semiconductor firm, in 2021.
SKC, the chemical unit of South Korea’s SK Group, has been transitioning to components sectors, with a focus on materials for secondary batteries and semiconductors. It has Absolics Inc., its Georgia-based chip packaging subsidiary in the U.S. that manufactures glass-based semiconductor substrates, aiming to become the first company to produce at scale this unique form of semiconductor packaging.
This photo shows glass substrate sheets developed by Absolics Inc. being showcased at CES in Las Vegas from Jan. 5-8, in this file photo provided by SKC on Jan. 9, 2023. (PHOTO NOT FOR SALE) (Yonhap)
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