The Ministry of Trade, Industry and Energy reported on Tuesday that it had signed a Memorandum of Understanding (MOU) with Samsung Electronics Co., SK hynix Inc., LG Chem Ltd., and other chip firms to collaborate on the advancement of semiconductor packaging.
The agreement entails the government and chip producers working together to secure the leading technologies in the field of advanced semiconductor packaging, as well as fostering companies in the concluding stages of semiconductor production.
The South Korean government is actively pursuing new research and development initiatives in the advanced packaging sector and the system semiconductor industry to lead the global market.
Advanced packaging necessitates cutting-edge technologies and is gaining traction as the next technological breakthrough in response to the increasing demand for multifunctional devices.
This file photo, provided by SK hynix Inc. on July 4, 2023, shows a semiconductor production factory. (PHOTO NOT FOR SALE) (Yonhap)
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